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Workflow design and management for IC supply chain

The work

AuthorsJames C. Chen; Hsin Rau; Cheng‐Ju Sun; Hung-Wen Stzeng; Chia‐Hung Chen
Editors
Typemisc
Year2009
Citekeychen2009workflow

Where it appeared

Published inInternational Conference on Networking, Sensing and Control
Pages697--701

From OpenAlex, which stores abstracts as an index of words and their positions: what is shown is rebuilt from that, and reads fluently whether or not it is what the author wrote.

Abstract

This research develops interaction models among companies in IC supply chain to study the information integration among them. The main processes of IC supply chain are IC design, wafer fabrication, wafer probe, IC packaging/ assembly, and final test. A workflow model between IC design houses and wafer fabrication plants is developed with focuses on purchase order, engineering data, and work-in-process status. This model facilitates the standardization and simplification for the information integration interfaces, which could increase the communication efficiency and effectiveness between customers and vendors. Finally, Extricity Alliance software is used in a case study to demonstrate the interaction process and information flow between IC design houses and wafer fabrication plants.

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Added2026-10-24 21:19 UTC
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Cite it as

@misc{chen2009workflow,
  title        = {Workflow design and management for IC supply chain},
  author       = {James C. Chen and Hsin Rau and Cheng‐Ju Sun and Hung-Wen Stzeng and Chia‐Hung Chen},
  year         = {2009},
  journal      = {International Conference on Networking, Sensing and Control},
  pages        = {697--701},
  doi          = {10.1109/icnsc.2009.4919362},
}

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