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A Fast \(I{-}V\) Screening Measurement for TDDB Assessment of Ultra-Thick Inter-Metal Dielectrics

The work

AuthorsArash Elhami Khorasani; Mark D. Griswold; T. L. Alford
Editors
Typearticle
Year2014
Citekeykhorasani2014fast

Where it appeared

Published inIEEE Electron Device Letters
PublisherInstitute of Electrical and Electronics Engineers
Volume35
Issue1
Pages117--119

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Abstract

Semiconductor manufacturing economics necessitate the development of novel and innovative techniques that can replace the traditional time consuming reliability methods, i.e., the constant voltage stress time-dependent dielectric breakdown (CVS-TDDB) tests. We show that positive charge trapping is a dominant process when ultra-thick oxides are stressed through the ramped voltage test. Exploiting the physics behind positive charge generation/trapping at high electric fields, a fast I-V measurement technique is proposed that can be used to effectively distinguish the ultra-thick oxides' intrinsic quality at low electric fields. It will be demonstrated, based on experimental data, that our proposed technique can be a suitable replacement for the CVS-TDDB as a quality screening tool.

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Cite it as

@article{khorasani2014fast,
  title        = {A Fast $I{-}V$ Screening Measurement for TDDB Assessment of Ultra-Thick Inter-Metal Dielectrics},
  author       = {Arash Elhami Khorasani and Mark D. Griswold and T. L. Alford},
  year         = {2014},
  journal      = {IEEE Electron Device Letters},
  publisher    = {Institute of Electrical and Electronics Engineers},
  volume       = {35},
  number       = {1},
  pages        = {117--119},
  doi          = {10.1109/led.2013.2290538},
}

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