Towards Deeply Scaled 3D MPSoCs with Integrated Flow Cell Array Technology

The work

TitleTowards Deeply Scaled 3D MPSoCs with Integrated Flow Cell Array Technology
AuthorsHalima Najibi; Alexandre Levisse; Marina Zapater; Mohamed M. Sabry Aly; David Atienza
Typeconference paper
Year2020
Citekeynajibi2020towards

Where it appeared

Published inProceedings of the Great Lakes Symposium on VLSI 2020
PublisherAssociation for Computing Machinery
Pages513--518

Identifiers

DOI10.1145/3386263.3406923
OpenAlexW3083254028

Access

Landing pagehttps://doi.org/10.1145/3386263.3406923
Free full texthttps://dl.acm.org/conference/glsvlsi

Abstract

Deeply-scaled three-dimensional (3D) Multi-Processor Systems-on-Chip (MPSoCs) enable high performance and massive communication bandwidth for next-generation computing. However as process nodes shrink, temperature-dependent leakage dramatically increases, and thermal and power management becomes problematic. In this context, Integrated Flow Cell Array (FCA) technology, which consists of inter-tier microfluidic channels, combines on-chip electrochemical power generation and liquid cooling of 3D MPSoCs. When connected to power delivery networks (PDN) of dies, FCAs provide an additional current compensating the voltage drop (IR-drop). In this paper, we evaluate for the first time how the IR-drop reduction and cooling capabilities of FCAs scale with advanced CMOS processes. We develop a framework to quantify the system-level impact of FCAs at technology nodes from 22nm to 3nm. Our results show that, across all considered nodes, FCAs reduce the peak temperature of a multi-core processor (MCP) and a Machine Learning (ML) accelerator by over 22°C and 35°C, respectively, compared to off-chip direct liquid cooling. Moreover, the low operation voltages and high temperatures at advanced nodes improve up to 2x FCA power generation. Hence, FCAs allow to keep the IR-drop below 5% for both the MCP and ML accelerator, saving over 10% TSV-reserved area, as opposed to using a High-Performance Computing (HPC) MPSoC liquid cooling solution.

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Where it came fromhttps://doi.org/10.1145/3386263.3406923

Where this came from

How it got herethe agent went looking · found via openalex
First seen2026-08-04
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Approved2026-08-17
In: drheap project Great Lakes Symposium on VLSI (GLSVLSI) venue

Cite it as

@inproceedings{najibi2020towards,
  title = {Towards Deeply Scaled 3D MPSoCs with Integrated Flow Cell Array Technology},
  author = {Halima Najibi and Alexandre Levisse and Marina Zapater and Mohamed M. Sabry Aly and David Atienza},
  year = {2020},
  booktitle = {Proceedings of the Great Lakes Symposium on VLSI 2020},
  pages = {513--518},
  publisher = {Association for Computing Machinery},
  doi = {10.1145/3386263.3406923},
  url = {https://dl.acm.org/conference/glsvlsi},
}

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