Design and Implementation of Ternary Logic Integrated Circuits by Using Novel Two-Dimensional Materials

The work

AuthorsMingqiang Huang; Xingli Wang; Guangchao Zhao; Philippe Coquet; Bengkang Tay
Typearticle
Year2019
Citekeyhuang2019design

Where it appeared

Published inApplied Sciences
PublisherMDPI AG
Volume9
Issue20
Pages4212

Identifiers

DOI10.3390/app9204212
OpenAlexW2980291515
ISSN2076-3417

Related

Distinct frombrusentsov2011ternary Ternary logic proposed on two-dimensional materials, against the ternary machine that was actually built and run. Linked so the modern circuit papers and the historical precedent are reachable from each other.

Abstract

With the approaching end of Moore’s Law (that the number of transistors in a dense integrated circuit doubles every two years), the logic data density in modern binary digital integrated circuits can hardly be further improved due to the physical limitation. In this aspect, ternary logic (0, 1, 2) is a promising substitute to binary (0, 1) because of its higher number of logic states. In this work, we carry out a systematical study on the emerging two-dimensional (2D) materials (MoS2 and Black Phosphorus)-based ternary logic from individual ternary logic devices to large scale ternary integrated circuits. Various ternary logic devices, including the standard ternary inverter (STI), negative ternary inverter (NTI), positive ternary inverter (PTI) and especially the ternary decrement cycling inverter (DCI), have been successfully implemented using the 2D materials. Then, by taking advantage of the optimized ternary adder algorithm and the novel ternary cycling inverter, we design a novel ternary ripple-carry adder with great circuitry simplicity. Our design shows about a 50% reduction in the required number of transistors compared to the existing ternary technology. This work paves a new way for the ternary integrated circuits design, and shows potential to fulfill higher logic data density and a smaller chip area in the future.

A copy is held

pdf, 2.5 MB. Not published — it may be under copyright. The facts and links here are.

How it got here

How it got hereagent via bibtex
Added2026-08-29 10:31 UTC
Approved bya person 2026-08-29 23:56 UTC

Cite it as

@article{huang2019design,
  title        = {Design and Implementation of Ternary Logic Integrated Circuits by Using Novel Two-Dimensional Materials},
  author       = {Mingqiang Huang and Xingli Wang and Guangchao Zhao and Philippe Coquet and Bengkang Tay},
  year         = {2019},
  journal      = {Applied Sciences},
  volume       = {9},
  number       = {20},
  pages        = {4212},
  publisher    = {MDPI AG},
  issn         = {2076-3417},
  doi          = {10.3390/app9204212},
}

This record lives at https://refs.drheap.org/huang2019design/ and will keep doing so.